PART |
Description |
Maker |
BZT52C5V1 BZT52C43 |
Planar Die Construction
|
SHENZHEN YONGERJIA INDU...
|
MMBZ5250B |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
BZT52C6V2S BZT52C11S |
Planar Die Construction Ultra-Small Surface Mount Package
|
TY Semiconductor Co., Ltd TY Semiconductor Co., L...
|
MBR830 MBR860 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
|
MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd. Kersemi Electronic Co., Ltd...
|
1N5819-T 1N5817-B 1N5817-T 1N5818-B 1N5819-B 1N581 |
Through-Hole Schottky Rectifiers Guard Ring Die Construction for Transient Protection
|
Diodes Incorporated
|
CPW |
Commercial Power, Axial Lead, Fireproof Inorganic Construction, Complete Welded Construction, Non-inductive Styles Available, High Thermal Conductivity and Humidity Resistance
|
Vishay
|
907-0010 912-0120 914-0040 914-0070 914-0140 912-0 |
PUNCH&DIE SET 3-12MM PUNCH&DIE 10.0MM CIRCULAR PUNCH&DIE 16.5MM CIRCULAR PUNCH&DIE 25.0MM CIRCULAR PUNCH&DIE 12.0MM CIRCULAR PUNCH&DIE 9.0MM CIRCULAR PUNCH&DIE 20.0MM CIRCULAR PUNCH&DIE 12.5MM CIRCULAR STRIPPER 37.0 X 13.7 D CON STRIPPER 31.75MM DIAMETER 低产31.75MM直径 LOUVRE TOOL 卢浮宫工 PUNCH&DIE 10.0MM CIRCULAR STRIPPER 67.2 X 16.5 D CON
|
Peregrine Semiconductor, Corp. Molex, Inc.
|
TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
S3K-13 S3MB |
Glass Passivated Die Construction 3.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
|
Diodes Incorporated
|
BZV85C51 BZV85C56 BZV85C5V1 BZV85C5V6 BZV85200 BZV |
SILICON PLANAR POWER ZENER DIODES 80mW, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown ECONOLINE: RQS & RQD - 1kVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 80% surface mount silicon Zener diodes 表面贴装硅稳压二极管
|
GOOD-ARK[GOOD-ARK Electronics] Central Semiconductor, Corp. NXP Semiconductors N.V.
|